Syllabus
1.1 Operation and characteristics of PN junction diode
1.2 Avalanche and Zener breakdown mechanisms
1.3 Rectifiers:
Half-wave rectifier
Full-wave rectifier
(Ripple factor, efficiency, and PIV ratings)
1.4 Filters:
C filter
L filter
Π (Pi) filter
2.1 NPN and PNP transistor: Construction and working
2.2 Transistor configurations:
CB (Common Base)
CE (Common Emitter)
CC (Common Collector)
2.3 Leakage currents
2.4 Input and output characteristics of CE mode
2.5 Relation between α and β
2.6 UJT: Construction, working, and characteristics
2.7 FET: Construction, working, and characteristics
2.8 MOSFET: Construction, working, and characteristics
3.1 LDR: Construction, working, and characteristics
3.2 LED: Construction, working, and characteristics
3.3 Photodiode: Construction, working, and characteristics
3.4 Phototransistor: Construction, working, and characteristics
3.5 Photovoltaic (Solar) cell: Construction, working, and characteristics
4.1 Introduction to IC technology
4.2 Advantages and disadvantages of ICs
4.3 Classification of ICs
4.4 Scale of integration up to V2LSI
4.5 Basic steps in fabrication of monolithic ICs
4.6 Fabrication of:
Resistor
Diode
Transistor
4.7 Basic concept of Embedded systems
Student will be able to design and build power supply.
• Design various circuits using various transistors.
• Able to make various applications of optoelectronics devices.
• Will acquire the knowledge about integration of electronics components for IC fabrication.
113206 BSC Semester 2 Electronics (NEP)
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